?High-precision positioning platform (positioning accuracy of ±2 microns)
?Meet test of 2,000 probes, used for multi-core simultaneous detection, improving production capacity and benefits
?High-precision optical module, combined with the latest image software algorithm, achieving automatic and accurate positioning of probes, and safe and reliable full-automatic test
?Through the unique mechanical arm adsorption technology, achieve nondestructive automatic loading and unloading transmission of Taiko\ltrathin\warpage wafers, etc.
?CHUCK's modular design, making selection and replacement more convenient and fast
?Equipped with a large-size probe grinding table to adapt to different probe grinding manners